Christopher Hill

June 1, 2016

The accidental thermal engineer: Do thermal resistances add up? (Part 2)

In my March post, I introduced the concept of “thermal resistance” (Rthj-a) as a measure of how easily a system […]
March 22, 2016

The accidental thermal engineer: Do thermal resistances add up? (Part 1)

In Figures 1 and 2 of my November 2015 post I demonstrated how (for a fixed PD) the Tj of […]
February 9, 2016

The accidental thermal engineer: Can we know Tj by looking at Tcase? (Part 3)

If you’ve spent some time in the world of power semiconductors, then it’s likely that you’ve come across the concept […]
January 18, 2016

The accidental thermal engineer: Can we know Tj by looking at Tcase? (Part 2)

November 12, 2015

The accidental thermal engineer: Can we know Tj by looking at Tcase?

At the end of my previous post – Top Clip , I mentioned we would be moving on to the […]
October 6, 2015

The accidental thermal engineer – LFPAK56: a top clip package

In my August post ‘A look at die-level heat transfer’, I introduced the idea of a MOSFET ‘detailed model’ which […]
September 3, 2015

The accidental thermal engineer – Top Clip

In my previous post ‘A look at die-level heat transfer’, I introduced a ‘detailed’ MOSFET die model and demonstrated how […]
August 13, 2015

The accidental thermal engineer – A look at die-level heat transfer

Most power semiconductor devices are constructed in a very similar way. The active part of the device, or ‘die’, is […]
July 22, 2015

The accidental thermal engineer – Simulation and reality

A large part of thermal analysis work is concerned with carrying out ‘what if?’ analyses. For example, if I have […]
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