September 8, 2015

NXP Ships Over 1 Billion SmartMX2 as Trend toward Tap-and-Go Accelerates

How popular is contactless payment? The numbers tell the story. The Smart Payment Association reports that it’s member shipped more […]
September 3, 2015

The accidental thermal engineer – Top Clip

In my previous post ‘A look at die-level heat transfer’, I introduced a ‘detailed’ MOSFET die model and demonstrated how […]
September 1, 2015

How to Prevent Identity Theft

It is a well-known fact: Internet usage is booming. 3.2 billion people are online, while more than 7 billion mobile […]
August 27, 2015

Improve network performance with VM offloads

Communications networks are becoming increasingly virtualized, as more and more applications are implemented either wholly or partly in software through […]
August 25, 2015

3 reasons hotels are switching to NFC

Hotels around the world have, for decades, used cards with magnetic stripes as room keys. They’re inexpensive and easy to […]
August 25, 2015

Take the reins off SDN

As I mention software-defined networking (SDN), you would probably think of large data centers. This makes sense because there is […]
August 20, 2015

Wear it’s at: wearable payment systems are boldly going forward

It’s an exciting time for mobile payments, with wearable technology now honing the industry’s cutting edge. As on the fashion […]
August 20, 2015

Achieve optimized performance for wireless LAN

Since 1997, when the first IEEE 802.11 wireless local-area network (WLAN) protocol was adopted – offering a meager 2 Megabits […]
August 13, 2015

The accidental thermal engineer – A look at die-level heat transfer

Most power semiconductor devices are constructed in a very similar way. The active part of the device, or ‘die’, is […]
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